NSF announces nearly $50 million partnership with Ericsson, IBM, Intel, and Samsung to support the future of semiconductor design and manufacturing

NSF | Directorate for Technology, Innovation and Partnerships
January 26, 2023

The U.S. National Science Foundation today announced a cross-sector partnership with Ericsson, IBM, Intel, and Samsung to support the design of the next generation of semiconductors as part of its Future of Semiconductors (FuSe) initiative.

“Future semiconductors and microelectronics will require transdisciplinary research spanning materials, devices, and systems, as well as the engagement of the full spectrum of talent in the academic and industrial sectors,” said NSF Director Sethuraman Panchanathan. “Partnerships such as this are essential to inform research needs, spur innovation, accelerate the translation of results to the market, and prepare the future workforce.”

Through this partnership activity, NSF will team with Ericsson, IBM, Intel, and Samsung to invest in projects that cultivate a broad coalition of science and engineering researchers to pursue holistic, “co-design” approaches. By intentionally supporting researchers who are integrating materials, devices, architectures, systems, and applications, new semiconductor technology is designed and developed in an integrated way. Co-design approaches simultaneously consider the device/system performance, manufacturability, recyclability, and impact on the environment.

Complete article from National Science Foundation.