Construction Contract Awarded for New Semiconductor Facility at MIT Lincoln Laboratory

Ariana Tantillo | MIT Lincoln Laboratory
February 8, 2022

The advanced research and prototyping facility will yield complex, integrated microelectronic components to enable scientific discovery and solve national security challenges.

The U.S. Army Corps of Engineers (USACE) has awarded a contract to Gilbane-Exyte Joint Venture to build the Compound Semiconductor Laboratory – Microsystem Integration Facility (CSL-MIF) at MIT Lincoln Laboratory.

“The CSL-MIF will enable the most advanced microelectronics research and prototyping in critically important national security areas for decades to come. We look forward to the many technology advances that will be developed through the combination of this new laboratory and our outstanding staff,” says Lincoln Laboratory Director Eric Evans.

Complete article from MIT News.

Explore

MIT researchers advance toward greater bandwidth, more energy-efficient communications

Elizabeth A. Thomson | Materials Research Laboratory

The FUTUR-IC research program integrates electronics and photonics in microchip systems.

AI HardwareAI SystemsPhotonics

Pablo Jarillo-Herrero stands in front of the MIT dome, holding a circular wafer displaying moire patterns over his head

Pablo Jarillo-Herrero wins Kavli Prize in Nanoscience

Julia C. Keller | School of Science

The MIT physicist shares the honor with two others for foundational research establishing the field of twistronics.

AI Hardware

Natnael Kahssay, wearing nitrile gloves, smiles and holds up a computer chip for the camera.

Discovering the Joy of Future-forward Electrical Engineering

Jane Halpern | Department of Electrical Engineering and Computer Science

One year in, MIT’s hands-on 6-5 (Electrical Engineering With Computing) degree program is already one of the most popular majors among first-year students.

AI HardwarePhotonicsQuantum

MIT AI Hardware Program