​EUV Lithography: What’s Happening and What’s Next

Wednesday, March 9, 2022 | 12:00pm ET
Speaker: Tony Yen, ASML

Please use this link for more information on the Microsystems Technology Laboratories (MTL) Spring Seminar Series.

Abstract: Nanolithography enables our intelligent society and extreme-ultraviolet (EUV) lithography is the latest enabling lithographic technology. ASML’s EUV exposure tools are being used in the high-volume production of logic and memory chips. In the words of Professor Jesús del Alamo of MIT, “It’s an absolutely revolutionary product, a breakthrough that is going to give a new lease of life to the industry for years.” For this presentation, I will start with a brief history of the development of EUV lithography and then present the technology’s present status, including its use in the manufacture of logic integrated circuits. I will then give a progress report on our next-generation EUV technology and an outlook for the rest of this decade.

Speaker Bio: Anthony Yen is Vice President and Head of Technology Development Center, ASML and Industrial Professor in College of Semiconductor Research, NTHU. He received his undergraduate degree in electrical engineering from Purdue University and his master’s, engineer’s, doctoral, and MBA degrees from MIT. From 1991 to 1997, he was with Texas Instruments as Member of Technical Staff and was on assignment at IMEC for the TI-IMEC joint program on advanced lithography. From 1997 to 2003, he was with TSMC where he first led the development of its lithography processes, making TSMC the first company to adopt 193-nm lithography in the manufacture of (0.13 micron generation) logic integrated circuits, and then co-led infrastructure development for next-generation-lithography technologies on assignment at SEMATECH. After a three-year stint at Cymer (now part of ASML) leading its marketing organization, he returned to TSMC in 2006. As head of Nanopatterning Technology Infrastructure Division, he led the development of EUV lithography, including its mask technology, and played a decisive role in developing EUVL for high-volume manufacturing. He has over 140 US patents and 100 publications on the patterning of semiconductor devices and circuits. He is a Fellow of the IEEE and SPIE, and a 2018 recipient of the Outstanding Electrical and Computer Engineer Award from Purdue University School of Electrical and Computer Engineering.