EUV lithography is now used to manufacture the most advanced integrated circuits, including memory, logic and AI chips, but Moore’s Law demands constant improvements. The NXE system is our 0.33NA platform which continues to evolve with better throughput via greater EUV source power, smaller Edge Placement Errors (EPE) and higher uptime. One possibility for further EPE reduction is to increase image contrast through the use of advanced exposure methods such as Dual Monopole.

Speaker
Tim Brunner
Tim Brunner holds a B.A. from Carleton College and a Ph.D from MIT, all in physics. He has worked in the area of lithography for chip production since 1981. After many years at IBM, he joined ASML in 2019, working in the Technology Development Center.
Explore
AI System Learns from Many Types of Scientific Information and Runs Experiments to Discover New Materials
Zach Winn | MIT News
The new “CRESt” platform could help find solutions to real-world energy problems that have plagued the materials science and engineering community for decades.
New Tool Makes Generative AI Models More Likely to Create Breakthrough Materials
Zach Winn | MIT News
With SCIGEN, researchers can steer AI models to create materials with exotic properties for applications like quantum computing.
New 3D Chips could Make Electronics Faster and more Energy-Efficient
Adam Zewe | MIT News
The low-cost, scalable technology can seamlessly integrate high-speed gallium nitride transistors onto a standard silicon chip.